Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II : proceedings of the international symposium /
| Corporate Authors: | , , , , , |
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| Other Authors: | , , |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Pennington, N.J. :
Electrochemical Society,
c2003
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| Series: | Proceedings (Electrochemical Society) ;
v. 2002-22 Proceedings (Electrochemical Society) ; v. 2003-10 |
| Subjects: |
| Item Description: | " ... papers presented at the International Symposium on Copper Interconnects, Low-k Inter-level Dielectrics and New Contact Metallurgies/Structures, ... was held as part of the 204th Meeting of The Electrochemical Society, Inc., in Orlando, FL, October 12-17, 2003"-- Preface "Papers presented at the International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ... was held as part of the 202nd Meeting of The Electrochemical Society, Inc., in Salt Lake City, UT, October 20-24, 2002"--Pref "Sponsoring Divisions: Dielectric Science and Technology, Electronics, Electrodeposition." |
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| Physical Description: | ix, 276 p. : ill. ; 24 cm ix, 346 p. : ill. ; 24 cm |
| Bibliography: | Includes bibliographical references and index Includes bibliographical references and indexes |
| ISBN: | 1566773792 1566773903 9781566773799 9781566773904 |