Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II : proceedings of the international symposium /

Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II : proceedings of the international symposium /

Bibliographic Details
Corporate Authors: International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II Orlando, Fla., International Symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics Salt Lake City, Utah, Electrochemical Society Dielectric Science and Technology Division, Electrochemical Society Electrodeposition Division, Electrochemical Society Electronics Division, Electrochemical Society Meeting
Other Authors: Baker, B. C, Bakshi, V, Mathad, G. S
Format: Conference Proceeding Book
Language:English
Published: Pennington, N.J. : Electrochemical Society, c2003
Series:Proceedings (Electrochemical Society) ; v. 2002-22
Proceedings (Electrochemical Society) ; v. 2003-10
Subjects:
Electronic packaging
Microelectronic packaging
Semiconductors > Junctions
Conference papers and proceedings

Internet

Stanford University

Holdings details from Stanford University
Call Number: TK7874 .S886 2002
TK7874 .S886 2003

Massachusetts Institute of Technology

Holdings details from Massachusetts Institute of Technology
Call Number: TK7870.15.I57 2002
TK7870.15.I57 2003

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