Proceedings 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces : Chateau Elan, Braselton, Georgia, March 15-18, 1998 /
The general subject of this meeting is electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems
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| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Reston, Va. : Piscataway, N.J. :
IMAPS ; IEEE,
[1998]
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