Coherency Stress and Transgranular Stress Corrosion Cracking of Cu-18Au Alloy /
It has been proposed that the lattice mismatch between a dealloyed layer and the substrate alloy may play a role in the transgranular stress corrosion cracking (TSCC) of copper alloys. This investigation uses the single-exposure X-ray technique to measure the residual stress in a dealloyed layer for...
| Main Authors: | , , |
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| Corporate Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
West Conshohocken, Pa. :
ASTM International,
1990
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| Subjects: |